Advances in Electronic Circuit Packaging Volume 2 Proceedings of the Second International Electronic Circuit Packaging Symposium, sponsored by the University of Colorado and EDN (Electrical Design News), held at Boulder, Colorado | EKB DL

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Home BookAdvances in Electronic Circuit Packaging Volume 2 Proceedings of the Second International Electronic Circuit Packaging Symposium, sponsored by the University of Colorado and EDN (Electrical Design News), held at Boulder, Colorado

Advances in Electronic Circuit Packaging Volume 2 Proceedings of the Second International Electronic Circuit Packaging Symposium, sponsored by the University of Colorado and EDN (Electrical Design News), held at Boulder, Colorado

Keywords

Technology & EngineeringElectronicsCircuitsElectrical

1962Book

Author(s)Gerald Walker

PublisherSpringer US

ISBN9781489972972

LanguageEnglish

SpringerLink

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