Packaging of High Power Semiconductor Lasers
Description
This book introduces high power semiconductor laser packaging design. The challenges of the design and various packaging and testing techniques are detailed by the authors. New technologies and current applications are described in detail.
Keywords
Technology & EngineeringPower Resources
2014Book
Author(s)Wei Zhao, Hui Liu, Xingsheng Liu, Lingling Xiong
PublisherSpringer New York
ISBN9781461492627
LanguageEnglish
