MEMS Packaging
Description
Written as a collective work by 14 outstanding microsystems packaging specialists from US industries, government laboratories and universities, MEMS Packaging provides a comprehensive view of the prevalent practices and enabling techniques in the assembly, packaging and testing of MEMS and microsystems. The book also addresses aspects of microassembly and testing technologies that are often overlooked.
Keywords
Technology & EngineeringElectronicsCircuitsIntegratedIndustrial DesignPackagingNanotechnology & MEMS
