Solder Paste in Electronics Packaging: Technology and Applications in Surface Mount, Hybrid Circuits, and Component Assembly

This guide aims to provide a working understanding of the latest solder paste principles and applications, enabling engineers to take advantage of today's surface mount technology. It shows how to use solder paste technology to improve interconnection performance and efficiency in hybrid circuits, printed circuits, and components. Coverage includes basic solder paste technologies, application techniques, reliability and testing, and solutions to specific problems. This book should be of interest to electronic engineers.